MCR08BT1 Ver la hoja de datos (PDF) - Kersemi Electronic Co., Ltd.
Número de pieza
componentes Descripción
Fabricante
MCR08BT1 Datasheet PDF : 9 Pages
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MCR08B, MCR08M
1.0
0.9
α
0.8 α = CONDUCTION
0.7
ANGLE
α = 30°
60°
0.6
90°
0.5
0.4
dc
0.3
180°
0.2
120°
0.1
00
0.1
0.2
0.3
0.4
0.5
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
Figure 8. Power Dissipation
0.7
1.0
0.1
0.01
0.0001 0.001
0.01
0.1
1.0
10
100
t, TIME (SECONDS)
Figure 9. Thermal Response Device
Mounted on Figure 1 Printed Circuit Board
2.0
VAK = 12 V
0.6
RL = 100 Ω
VAK = 12 V
RL = 3.0 kΩ
0.5
1.0
0.4
0.3–40 –20
0
20
40
60
80
TJ, JUNCTION TEMPERATURE, (°C)
0
110
–40 –20
0
20
40
60
80
110
TJ, JUNCTION TEMPERATURE, (°C)
Figure 10. Typical Gate Trigger Voltage
versus Junction Temperature
Figure 11. Typical Normalized Holding Current
versus Junction Temperature
0.7
0.65
0.6
0.55
0.5
0.45
0.4
0.35
0.3
0.1
1000
100
VAK = 12 V
RL = 100 Ω
10
TJ = 25°C
RGK = 1000 Ω, RESISTOR
CURRENT INCLUDED
WITHOUT GATE RESISTOR
VAK = 12 V
RL = 100 Ω
1.0
10
100
IGT, GATE TRIGGER CURRENT (µA)
Figure 12. Typical Range of VGT
versus Measured IGT
1.0
1000
–40 –20
0
20
40
60
80
110
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Typical Gate Trigger Current
versus Junction Temperature
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