74ABT841 Ver la hoja de datos (PDF) - NXP Semiconductors.
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74ABT841 Datasheet PDF : 15 Pages
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NXP Semiconductors
74ABT841
10-bit bus interface latch; 3-state
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
y
Z
24
pin 1 index
1
e
E
A
X
c
HE
vM A
13
12
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT355-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.5
0.2
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 12. Package outline SOT355-1 (TSSOP24)
74ABT841
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 7 November 2011
© NXP B.V. 2011. All rights reserved.
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