Philips Semiconductors
Fast soft-recovery
controlled avalanche rectifiers
Preliminary specification
BYG60 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• UL 94V-O classified plastic
package
• Shipped in 12 mm embossed tape.
DESCRIPTION
DO-214AC surface mountable
package with glass passivated chip.
handbook, 4 columns
cathode
band
k
a
Top view
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
Side view
MSA474
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
VRRM
VR
IF(AV)
IFSM
repetitive peak reverse voltage
BYG60D
BYG60G
BYG60J
BYG60K
BYG60M
continuous reverse voltage
BYG60D
BYG60G
BYG60J
BYG60K
BYG60M
average forward current
non-repetitive peak forward current
averaged over any 20 ms period;
Ttp = 100 °C; see Fig.2
averaged over any 20 ms period;
Al2O3 PCB mounting (see Fig.7);
Tamb = 60 °C; see Fig.3
averaged over any 20 ms period;
epoxy PCB mounting (see Fig.7);
Tamb = 60 °C; see Fig.3
t = 10 ms half sine wave;
Tj = Tj max prior to surge;
VR = VRRMmax
MIN. MAX. UNIT
−
200 V
−
400 V
−
600 V
−
800 V
−
1000 V
−
200 V
−
400 V
−
600 V
−
800 V
−
1000 V
−
1.90 A
−
0.90 A
−
0.65 A
−
25 A
1996 Jun 05
2