HMC263LP4E Ver la hoja de datos (PDF) - Analog Devices

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HMC263LP4E

GaAs MMIC LOW NOISE AMPLIFIER, 24 - 36 GHz

Analog Devices 

HMC263LP4E

v02.1017

GaAs MMIC LOW NOISE

AMPLIFIER, 24 - 36 GHz

Absolute Maximum Ratings

Drain Bias Voltage (Vdd1, Vdd2)

RF Input Power (RFIN)(Vdd = +3 Vdc)

Channel Temperature

Continuous Pdiss (T = 85 °C)

(derate 7.7 mW/°C above 85 °C)

Thermal Resistance

(channel to ground paddle)

Storage Temperature

Operating Temperature

+5.5 Vdc

-5 dBm

175 °C

0.7 W

130 °C/W

-65 to +150 °C

-40 to +85 °C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Outline Drawing

PIN 1

INDICATOR

0.90

0.85

0.80

SEATING

PLANE

24-Lead Lead Frame Chip Scale Package [LFCSP]

4 x 4 mm Body and 0.85 mm Package Height

(CP-24-16)

Dimensions shown in millimeters

4.10

4.00 SQ

3.90

0.30

0.25

0.18

19

18

24

1

0.50

BSC

EXPOSED

PAD

DETAIL A

(JEDEC 95)

PIN 1

INDICATOR AREA OPTIONS

(SEE DETAIL A)

2.85

2.70 SQ

2.55

TOP VIEW

13

6

0.50

0.40

12

7

BOTTOM VIEW

0.20 MIN

0.30

0.05 MAX

0.02 NOM

COPLANARITY

0.08

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.20 REF

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8.

24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.85 mm Package Height

(CP-24-16)

Dimensions shown in millimeters.

Package Information

Part Number

Package Body Material

Lead Finish

HMC263LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn

[1] 4-Digit lot number XXXX

[2] Max peak reflow temperature of 260 °C

MSL Rating

MSL3 [2]

Package Marking [1]

H263

XXXX

For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106

5

Phone: 781-329-4700 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D

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