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SD211 Ver la hoja de datos (PDF) - Micross Components

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SD211 Datasheet PDF : 1 Pages
1
SD211 / 213 / 215
SD211DE / SD213DE / SD215DE N-Channel Lateral DMOS Switch - Zener Protected
Description:
The SD211DE / SD213DE / SD215DE are enhancementmode
MOSFETs designed for high speed lowglitch switching in audio, video
and highfrequency applications. The family is normally used for ±5V
analog switching or as a high speed driver of the SD214. These
MOSFETs utilize lateral construction to achieve low capacitance and
ultrafast switching speeds. An integrated Zener diode provides ESD
protection A polysilicon gate is featured for manufacturing reliability.
See SD5000 and SD54000 series for quad configurations.
For nonzener protected versions see SD210DE / SD214DE series
Features:
ƒ UltraHigh Speed Switching—tON: 1ns
ƒ UltraLow Reverse Capacitance: 0.2pF
ƒ Low Guaranteed RDS @5V
ƒ Low TurnOn Threshold Voltage (1.5V max)
ƒ NChannel Enhancement Mode
Benefits:
ƒ HighSpeed System Performance
ƒ Low Insertion Loss at High Frequencies
ƒ Low Transfer Signal Loss
ƒ Single Supply Operation & Simple Driver Requirement
Availability:
SD211DE / SD213DE / SD215DE – TO72 , 55°C to 125°C
SD211DE / SD213DE / SD215DE Bare die form
Contact Micross for full package dimensions
Pinout:
Top View
Applications:
ƒ Fast Analog Switching
ƒ Fast Sample & Holds
ƒ PixelRate Switching
ƒ DAC Deglitchers
ƒ HighSpeed Driver
MAXIMUM RATINGS
LIMIT IN VOLTS
MAXIMUM RATINGS
LIMIT
UNIT
SD211 SD213 SD215
(Continued)
GateDrain, GateSource Voltage 30/25 15/25 25/30
Drain Current
50
mA
GateSubstrate Voltage
0.3/25 0.3/25 0.3/30
Lead Temperature (1/16” from ease, 10s)
300
°C
DrainSource Voltage
30
10
20
Storage Temperature
65 to 150 °C
SourceDrain Voltage
10
10
20
Operating Junction Temperature
55 to 125 °C
Drain Substrate Voltage
30
15
25
Power Dissipation
Click To Buy SourceSubstrate Voltage
15
15
25
ELECTRICAL SPECIFICATION
TA = 25°C unless otherwise noted
SYMBOL
TEST CONDITIONS
Derate 3mW/C° above 25°C
300
LIMITS
TYP SD211DE
SD213DE
SD215DE
MIN MAX MIN MAX MIN MAX
mW
UNIT
DRAINSOURCE BREAKDOWN
VOLTAGE
V(BR)DS
VGS = VBS = 0V, ID = 10µA 35 30
VGS = VBS = 5V, ID = 10nA 30 10
10
20
SOURCEDRAIN BREAKDOWN
V(BR)SD
VGD = VBD = 5V, IS = 10nA 22 10
10
20
VOLTAGE
V
DRAINSUBSTRATE BREAKDOWN
V(BR)DBO
VGB = 0V, ID = 10nA
35 15
15
25
VOLTAGE
Source Open
SOURCESUBSTRATE BREAKDOWN
VOLTAGE
V(BR)SBO
VGB = 0V, IS = 10µA
Drain Open
35 15
15
25
DRAINSOURCE LEAKAGE
SOURCEDRAIN LEAKAGE
GATE LEAKAGE
IDS(off)
VGS=VBS =5V VDS = 10V 0.4
10
10
VDS = 20V 0.9
10
ISD(off)
VGD =VBD=5V VSD = 10V 0.5
10
10
nA
VSD = 20V 1
10
IGBS
VDB = VSB = 0V , VGB = 30V 0.01
100
100
100
THRESHOLD VOLTAGE
VGS(th)
VDS =VGS , ID = 1µA, VSB = 0V 0.8 0.5
1.5
0.1
1.5
0.1
1.5
V
VGS = 5V 58
70
70
70
VGS = 10V 38
45
45
45
DRAINSOURCEON RESISTANCE
RDS(on)
VSB = 0V
VGS = 15V 30
ID = 1mA VGS = 20V 26
VGS = 25V 24
FORWARD TRANSCONDUCTANCE
gfs
VDS = 10V , VSB = 0V
11 10
10
10
mS
gos
ID = 20mA, f = 1kHz
0.9
9
GATE NODE CAPACITANCE
C(GS+GD+GB)
2.5
3.5
3.5
3.5
DRAIN NODE CAPACITANCE
C(GD+GB)
VDS = 10V , f = 1MHz
1.1
1.5
1.5
1.5
pF
SOURCE NODE CAPACITANCE
C(GS+SB)
VGS = VBS = 15V
3.7
5.5
5.5
5.5
REVERSE TRANSFER CAPACITANCE
Crss
0.2
0.5
0.5
0.5
TURNON TIME
tD(on)
0.5
1
1
1
tr
VSB = 0V, VIN 0 to 5V,
0.6
1
1
-
1
ns
TURNOFF TIME
tD(off)
RG = 25, VDD = 5V RL =
2
-
-
This is trial version tf
680
6
-
-
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents
If you want get full version, please register it, thank you. or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
Micross Components Ltd, United Kingdom, Tel: +44 1603 788967, Fax: +44 1603788920, Email: chipcomponents@micross.com Web: www.micross.com
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