Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
2.3 (0.091)
0.8 (0.031)
Reflow Löten
Reflow Soldering
3.3 (0.130)
3.3 (0.130)
SFH 4250S
0.7 (0.028)
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
6.1 (0.240)
2.8 (0.110)
Cu Fläche /
Cu-area
Lötstoplack
Solder resist
16 mm2 per pad
OHFP3021
Wellenlöten TTW
TTW Soldering
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
2011-03-10
2.8 (0.110) 0.5 (0.020)
Lötstoplack
Solder resist
Cu Fläche / > 16 mm2 per pad
Cu-area
OHPY3040
7