SC1101 Ver la hoja de datos (PDF) - Semtech Corporation

Número de pieza

componentes Descripción

Fabricante

SC1101

Asynchronous Voltage Mode PWM Controller

Semtech Corporation 

SC1101

POWER MANAGEMENT

Applications Information

Layout Guidelines

Careful attention to layout requirements are necessary

for successful implementation of the SC1101 PWM

controller. High currents switching at 200kHz are present

in the application and their effect on ground plane volt-

age differentials must be understood and minimized.

1). The high power parts of the circuit should be laid out

first. A ground plane should be used, the number and

position of ground plane interruptions should be such as

to not unnecessarily compromise ground plane integrity.

Isolated or semi-isolated areas of the ground plane may

be deliberately introduced to constrain ground currents

to particular areas, for example the input capacitor and

bottom Schottky ground.

rents are supplied by Cout only, and connections between

Cout and the load must be short, wide copper areas to

minimize inductance and resistance.

5) The SC1101 is best placed over an isolated ground

plane area. GND and PGND should be returned to this

isolated ground. This isolated ground area should be con-

nected to the main ground by a trace that runs from the

GND pin to the ground side of (one of) the output

capacitor(s). If this is not possible, the GND pin may be

connected to the ground path between the Output

Capacitor(s) and the Cin, Q1, D1 loop. Under no circum-

stances should GND be returned to a ground inside the

Cin, Q1, D1 loop.

2). The loop formed by the Input Capacitor(s) (Cin), the

Top FET (Q1) and the Schottky (D1) must be kept as small

as possible. This loop contains all the high current, fast

transition switching. Connections should be as wide and

as short as possible to minimize loop inductance. Mini-

mizing this loop area will reduce EMI, lower ground injec-

tion currents, resulting in electrically “cleaner” grounds

for the rest of the system and minimize source ringing,

resulting in more reliable gate switching signals.

6) Vcc for the SC1101 should be supplied from the 5V

supply through a 10Ω resistor, the Vcc pin should be

decoupled directly to GND by a 0.1µF ceramic capacitor,

trace lengths should be as short as possible.

7) The Current Sense resistor and the divider across it

should form as small a loop as possible, the traces run-

ning back to CS(+) and CS(-) on the SC1101 should run

parallel and close to each other.

3). The connection between the junction of Q1, D1 and

the output inductor should be a wide trace or copper

region. It should be as short as practical. Since this con-

nection has fast voltage transitions, keeping this con-

nection short will minimize EMI. The connection between

the output inductor and the sense resistor should be a

wide trace or copper area, there are no fast voltage or

current transitions in this connection and length is not

so important, however adding unnecessary impedance

will reduce efficiency.

4) The Output Capacitor(s) (Cout) should be located as

close to the load as possible, fast transient load cur-

8) To minimize noise pickup at the sensitive FB pin, the

feedback resistors should both be close to the SC1101

with the bottom resistor (Rb) returned to ground at the

GND pin.

Under Voltage Lockout

The under voltage lockout circuit of the SC1101 assures

that the high-side MOSFET driver outputs remain in the

off state whenever the supply voltage drops below set

parameters. Lockout occurs if VCC falls below 3.8V. Nor-

mal operation resumes once VCC rises above 3.8V.

 2005 Semtech Corp.

4

www.semtech.com

Share Link: