ARA200A09 Ver la hoja de datos (PDF) - Matsushita Electric Works
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ARA200A09 Datasheet PDF : 3 Pages
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RA
REFERENCE DATA
1. High frequency characteristics
Sample: ARA200A12
Measuring method: Measured with HP network analyzer (HP8753C).
• Insertion loss
0
COM-NO
• Isolation
0
0.2
20
COM-NC
0.3
30
0.4
40
0.6
60
COM-NC
COM-NO
CONTACT sets
0.8
80
1.0
300kHz
0.5GHz
Frequency
1.0GHz
100
300kHz
0.5GHz
Frequency
1.0GHz
• V.S.W.R.
1.5
1.4
1.3
1.2
1.1
1.0
300kHz
COM-NC
COM-NO
0.5GHz
Frequency
1.0GHz
NOTES
1. Coil operating power
Pure DC current should be applied to the
coil. The wave form should be rectangu-
lar. If it includes ripple, the ripple factor
should be less than 5%.
However, check it with the actual circuit
since the characteristics may be slightly
different. The nominal operating voltage
should be applied to the coil for more
than 10 ms to set/reset the latching type
relay.
2. Coil connection
When connecting coils, refer to the wiring
diagram to prevent mis-operation or mal-
function.
3. External magnetic field
Since RA relays are highly sensitive po-
larized relays, their characteristics will be
affected by a strong external magnetic
field. Avoid using the relay under that
condition.
4. Cleaning
For automatic cleaning, the boiling meth-
od is recommended. Avoid ultrasonic
cleaning which subjects the relays to high
frequency vibrations, which may cause
the contacts to stick.
It is recommended that alcoholic solvents
be used.
5. Soldering
Manual soldering shall be performed un-
der following condition.
Tip temperature: 280°C to 300°C .536°F
to 572°F
Wattage: 30 to 60W
Soldering time: within 5s
In case of automatic soldering, the follow-
ing conditions should be observed
1) Position of measuring temperature
1.0mm .039inch B
A
A: Surface of PC board where relay is mounted.
B: Above the PC board surface.
2) IR (infrared reflow) soldering method
A:
B:
T5
T4
T3
T2
T1
t1
T1=150°C 302°F
T2=160°C 320°F
T3=183°C 361°F
T4=245°C 473°F
T5=270°C 518°F
t2 t3 t4 t5
t2 - t1 = 80 to 120 s
t5 - t3 = 30 to 40 s
t4 = 170 to 190 s
Temperature rise of relay itself may vary
according to the mounting level or the
heating method of reflow equipment.
Therefore, please set the temperature of
soldering portion of relay terminal and
the top surface of the relay case not to
exceed the above mentioned soldering
condition.
It is recommended to check the tempera-
ture rise of each portion under actual
mounting condition before use.
The soldering earth shall be performed
by manual soldering.
For Cautions for Use, see Relay Technical Information (Page 48 to 76).
98/21/2000
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