MC100E310FNG Ver la hoja de datos (PDF) - ON Semiconductor
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MC100E310FNG Datasheet PDF : 8 Pages
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MC100E310
Table 6. AC CHARACTERISTICS VCCx = 5.0 V; VEE= 0 V or VCCx = 0 V; VEE = −5.0 V (Note 7)
−40°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
fMAX
tPLH
tPHL
Maximum Toggle Frequency
700 900
700 900
700 900
MHz
Propagation Delay to Output
IN (differential) (Note 8) 525
IN (single−ended) (Note 9) 500
725 550
750 550
750 575
800 600
ps
775
850
tskew
Within−Device Skew (Note 10)
Part−to−Part Skew (Diff)
75
50
50
ps
250
200
200
tJITTER
VPP
Random Clock Jitter (RMS)
Input Voltage Swing
(Differential Configuration)
<1
<1
<1
ps
500
500
500
mV
tr/tf
Output Rise/Fall Time
(20%−80%)
200
600 200
600 200
600 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. VEE can vary −0.46 V / +0.8 V.
8. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the
differential output signals. See Definitions and Testing of ECLinPS AC Parameters in Chapter 1 (page 1−12) of the ON Semiconductor
High Performance ECL Data Book (DL140/D).
9. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
10. The within−device skew is defined as the worst case difference between any two similar delay paths within a single device.
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