PC1231XNSZ0F Ver la hoja de datos (PDF) - Sharp Electronics

Número de pieza

componentes Descripción

Fabricante

PC1231XNSZ0F

DIP 4pin Reinforced Insulation Type, High CMR, Low Input Current Photocoupler

Sharp Electronics 

PC1231xNSZ0F Series

■ Model Line-up

Lead Form

Package

Trough-Hole

Wide Trough-Hole

Sleeve

100pcs/sleeve

Rank mark

IC [mA]

(IF=0.5mA, VCE=5V, Ta=25˚C)

DIN EN60747-5-2 −

Approved

−

Approved −

PC12310NSZ0F PC12310YSZ0F PC12310NFZ0F PC12310YFZ0F with or without

Model No. PC12311NSZ0F PC12311YSZ0F PC12311NFZ0F PC12311YFZ0F

A

0.25 to 2.0

0.5 to 1.25

Lead Form

Package

SMT Gullwing

Wide SMT Gullwing

Taping

2 000pcs/reel

Rank mark

IC [mA]

(IF=0.5mA, VCE=5V, Ta=25˚C)

DIN EN60747-5-2 −

Approved

−

Approved −

PC12310NIP0F PC12310YIP0F PC12310NUP0F PC12310YUP0F with or without

Model No.

PC12311NIP0F PC12311YIP0F PC12311NUP0F PC12311YUP0F A

0.25 to 2.0

0.5 to 1.25

Please contact a local SHARP sales representative to inquire about production status.

Sheet No.: D2-A02903FEN

6

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