BAL74,215 Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Fabricante
BAL74,215 Datasheet PDF : 9 Pages
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Philips Semiconductors
High-speed diode
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
Product specification
BAL74
SOT23
D
B
E
A
X
3
1
e1
bp
e
2
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1 0.48 0.15 3.0
0.38 0.09 2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45 0.55
0.15 0.45
0.2
0.1
OUTLINE
VERSION
SOT23
2003 Dec 17
REFERENCES
IEC
JEDEC
EIAJ
TO-236AB
7
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
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