NCP360SNT3G Ver la hoja de datos (PDF) - ON Semiconductor
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NCP360SNT3G
ON Semiconductor
NCP360SNT3G Datasheet PDF : 10 Pages
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NCP360
PACKAGE DIMENSIONS
D
ÍÍÍ PIN ONE
ÍÍÍÍÍÍ REFERENCE
2X
0.10 C
2X
0.10 C
0.10 C
6X
0.08 C
6X L
D2
1
A
B
UDFN6 2x2, 0.65P
CASE 517AB-01
ISSUE B
E
A3
A
A1
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3
0.127 REF
b 0.25 0.35
D
2.00 BSC
D2 1.50 1.70
E
2.00 BSC
E2 0.80 1.00
e
0.65 BSC
K 0.20 ---
L 0.25 0.35
SOLDERING FOOTPRINT*
0.95
1
6X
0.47
6X
0.40
e 4X
3
1.70
E2
6X K
6
4
BOTTOM VIEW
6X b
0.10 C A B
0.05 C
0.65
PITCH
2.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
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