EMIF02-SPK03F1 Ver la hoja de datos (PDF) - STMicroelectronics

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Fabricante

EMIF02-SPK03F1

2-channel EMI filter and ESD protection for speaker phone

STMicroelectronics 

Package information

3

Package information

EMIF02-SPK03F2

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 13. Package dimensions

500 µm ±10

250 µm ±10

315 µm ±50

650 µm ±65

0.89 mm ±50 µm

Figure 14. Footprint

Copper pad Diameter:

250 µm recommended, 300 µm max.

Solder stencil opening:

330 µm recommended

Solder mask opening recommendation:

340 µm min. for 315 µm copper pad diameter

Figure 15. Marking

Dot, ST logo

ECOPACK status

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

xxz

y ww

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Doc ID 023219 Rev 1

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