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NTE3035A Datasheet PDF : 2 Pages
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NTE3035A
Phototransistor Detector
Description:
The NTE3035A is designed for a wide variety of industrial processing and control applications requir-
ing a sensitive detector. The NTE3034A is is an identical package and is designed to be used with
the NTE3029A infrared emitter.
Features:
D Miniature, Low Profile, Clear Plastic Package
D Designed for Automatic Handling and Accurate Positioning
D Side Looking, with Molded Lens
D High Volume, Economical
Absolute Maximum Ratings: (TA = +25°C unless otherwise specified)
Collector–Emitter Voltage, VCEO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60V
Total Device Dissipation (TA = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150mW
Derate Above 25°C (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2mW/°C
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +100°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +100°C
Lead Temperature (During Soldering, 1/16” from case, 5sec max., Note 2), TL . . . . . . . . . . +260°C
Electrical Characteristics: (TA = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min Typ Max Unit
Collector Dark Current
Collector–Emitter Breakdown Voltage
Capacitance
ID VCE = 10V, H [ 0
V(BR)CEO IC = 10mA, H [ 0
Cce VCC = 5V, f = 1MHz
– – 100 nA
60 – – V
– 3.9 – pF
Optical Characteristics: (TA = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Collector Light Current
IL
VCE = 5V, H = 500µW/cm2,
λ = 940nm
Turn–On Time
Turn–Off Time
ton H = 500µW/cm2, VCC = 5V,
toff
RL = 100Ω
Saturation Voltage
VCE(sat) H = 500µW/cm2, λ = 940nm,
IC = 2mA, VCC = 5V
Wavelength of Maximum Sensitivity λs
Min Typ Max Unit
5 25 – mA
– 125 – µs
– 150 – µs
– 0.75 1.0 V
– 0.8 – µm
Note 1. Measured with device soldered into a typical PC board.
Note 2. Heat sink should be applied to leads during soldering to prevent case temperature from ex-
ceeding +100°C.
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