FSAV330MTCX(2008) Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FSAV330MTCX Datasheet PDF : 9 Pages
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Physical Dimensions
5.00±0.10
4.55
4.4±0.1
0.11
0.65
1.45
5.00
5.90
4.45 7.35
12°
MTC16rev4
Figure 7. 16-Lead, Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2002 Fairchild Semiconductor Corporation
FSAV330 • Rev. 1.0.3
8
www.fairchildsemi.com
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