MMSZ5221B Ver la hoja de datos (PDF) - Shenzhen Luguang Electronic Technology Co., Ltd
Número de pieza
componentes Descripción
Fabricante
MMSZ5221B Datasheet PDF : 4 Pages
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FEATURES
z Planar die construction.
z 500mW power dissipation.
z General purpose, medium current.
Pb
Lead-free
z Ideally suited for automated assembly processes.
MMSZ5221B-MMSZ5262B
Surface mount zener diode
APPLICATIONS
z Zener diode.
z Ultra-small surface mount package.
SOD-123
ORDERING INFORMATION
Type No.
Marking
MMSZ5221B-MMSZ5262B
See table 2
Package Code
SOD-123
MAXIMUM RATING @ Ta=25℃ unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ IF=10mA
VF
0.9
V
Power Dissipation
Pd
500
mW
Thermal resistance,junction to ambient air
RθjA
350
℃/W
Junction temperature
Tj
150
℃
Storage temperature range
Tstg
-65 to +150
℃
Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2.
2. Tested with pulses, Tp ≤1.0ms.
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