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MPX2300D Datasheet PDF : 4 Pages
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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by MPX2300D/D
Chip Pak
High Volume Pressure
Sensor for Disposable,
Backside Pressure Applications
Motorola has developed a low cost, high volume, miniature pressure sensor package
which is ideal as a sub–module component or a disposable unit. The unique concept of
the Chip Pak allows great flexibility in system design while allowing an economic solution
for the designer. This new chip carrier package uses Motorola’s unique sensor die with its
patented, piezoresistive implant technology, along with the added feature of on–chip,
thin–film temperature compensation and calibration.
Features:
• Low Cost
• Patented piezoresistive strain gauge implant, temperature compensation
and calibration all integrated on a single, monolithic sensor die.
• Pressure Range Available: 0–300 mmHg
• Polysulfone (Mindell S–1000) Case Material (Medical, Class VI Approved)
MPX2300D
PRESSURE SENSORS
Motorola is offering the Chip Pak option package. Applica-
tion–specific parts will have an “SPX” prefix, followed by a
four digit number, unique to the specific customer. Devices
will be shipped in a tape and reel packaging.
NOTE: The die and wire bonds are exposed on the front
MAXIMUM RATINGS
Overpressure (Backside)
Burst Pressure
Supply Voltage
Storage Temperature
Operating Temperature
Rating
Motorola’s MPX2300D Pressure Sensors. Motorola’s
MPX2300D pressure sensor has been designed for medical
usage by combining the performance of Motorola’s shear
stress pressure sensor design and the use of biomedically
approved materials. Materials with a proven history in
medical situations have been chosen to provide a sensor
that can be used with confidence in applications, such as
invasive blood pressure monitoring. It can be sterilized using
ethylene oxide. The portions of the pressure sensor that are
required to be biomedically approved are the rigid housing
and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
intracutaneous test in rabbits, and system toxicity, USP.
CHIP PAK ELEMENT
CASE 423–03
Style 1
side of the Chip Pak (pressure is applied to the backside of
the device). Front side die and wire protection must be
provided in the customer’s housing. Use caution when
handling the devices during all processes.
Pin Number, Style 1
1
2
3
4
VS
S+
S–
Ground
Symbol
Value
Unit
Pmax
125
PSI
Pburst
1000
kPa
VSmax
10
Vdc
Tstg
85
°C
TA
+ 15 to + 40
°C
A silicone dielectric gel that has been used extensively in
implants covers the silicon piezoresistive sensing element.
The gel is a nontoxic, nonallergenic polymer system which
passes pyrogen testing, as well as meeting all USP XX Bio-
logical Testing Class VI requirements. The properties of the
gel allow it to transmit pressure uniformly to the diaphragm
surface, while isolating the internal electrical connections
from the corrosive effects of fluids, such as saline solution.
The gel provides electrical isolation sufficient to withstand
defibrillation testing, as specified in the proposed Association
for the Advancement of Medical Instrumentation (AAMI)
Standard for blood pressure transducers. A biomedically ap-
proved opaque filler in the gel prevents bright operating room
lights from affecting the performance of the sensor.
REV 1
©MMoottoororolal,aInSc.e1n9s95or Device Data
1
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