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RT9199GSP Ver la hoja de datos (PDF) - Richtek Technology

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RT9199GSP Datasheet PDF : 13 Pages
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RT9199
As shown in Figure 12, the amount of copper area to which the SOP-8 (Exposed Pad) is mounted affects thermal
performance. When mounted to the standard SOP-8 (Exposed Pad) pad of 2 oz. copper (Figure 12.a), θJA is 86°C/W.
Adding copper area of pad under the SOP-8 (Exposed Pad) (Figure 12.b) reduces the θJA to 73°C/W. Even further,
increasing the copper area of pad to 70mm2 (Figure 12.d) reduces the θJA to 65°C/W.
(a) Copper Area = 10mm2, θJA = 86°C/W
(b) Copper Area = 30mm2, θJA = 73°C/W
(c) Copper Area = 50mm2, θJA = 68°C/W
(d) Copper Area = 70mm2, θJA = 65°C/W
Figure 12. Thermal Resistance vs. Copper Area Layout Thermal Design
DS9199-07 September 2007
www.richtek.com
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