CMX602BE4 Ver la hoja de datos (PDF) - CML Microsystems Plc

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componentes Descripción

Fabricante

CMX602BE4

Calling Line Identifier plus Call Waiting (Type II)

CML Microsystems Plc 

Calling Line Identifier

CMX602B

Section

CONTENTS

Page

1.1 Brief Description ............................................................................... 1

1.2 Block Diagram.................................................................................... 3

1.3 Signal List ............................................................................................ 4

1.4 External Components ..................................................................... 6

1.5 General Description ......................................................................... 7

1.5.1 Mode Control Logic ................................................................... 7

1.5.2 Input Signal Amplifier ................................................................ 7

1.5.3 Bandpass Filter .......................................................................... 8

1.5.4 Level Detector ............................................................................ 8

1.5.5 FSK Demodulator....................................................................... 9

1.5.6 FSK Data Retiming..................................................................... 9

1.5.7 Tone Alert Detector.................................................................. 10

1.5.8 Ring or Line Polarity Reversal Detector ................................ 11

1.5.9 Xtal Osc and Clock Dividers ................................................... 13

1.6 Application Notes ........................................................................... 14

1.6.1 'On-Hook' Operation ................................................................ 14

1.6.2 'Off-Hook' Operation ................................................................ 17

1.7 Performance Specification ......................................................... 19

1.7.1 Electrical Performance ............................................................ 19

1.7.2 Packaging ................................................................................. 23

 2003 CML Microsystems Plc

2

D/602B/2

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