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XC6501A451GL Ver la hoja de datos (PDF) - TOREX SEMICONDUCTOR

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XC6501A451GL Datasheet PDF : 21 Pages
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XC6501 Series
PIN CONFIGURATION
*The heat dissipation pad of the USP-4 package is recommended to solder as the
recommended mount pattern and metal mask pattern for mounting strength. The mount
pattern should be electrically opened or connected to the VSS (No.2) pin.
PIN ASSIGNMENT
USP-3
1
2
3
-
-
PIN NUMBER
USP-4 SSOT-24
4
4
1
3
2
2
3
1
-
-
SOT-25
1
5
2
3
4
PIN NAME
VIN
VOUT
VSS
CE
NC
FUNCTION
Power Supply
Output
Ground
ON/OFFControl
No Connection
PRODUCT CLASSIFICATION
Ordering Information
XC6501①②③④⑤⑥
DESIGNATOR
DESCRIPTION
Regulator Type
②③
Output Voltage
Output Voltage
Accuracy
2/21
Packages
Device Orientation
SYMBOL
A
B
C
D
P
1250
1
A
H
G
N
M
R
L
DESCRIPTION
: CE High Active, Without CE Pull-down, Without CL discharge
: CE High Active, Without CE Pull-down, With CL discharge
: CE High Active, With CE Pull-down, Without CL discharge
: CE High Active, With CE Pull-down, With CL discharge
: 3 pin, without CE pin (USP-3)
: ex.)28V → ②=2, =8
: 0.1V increments
Accuracy 1.2V1.9V (±0.02V), 2.05.0V (±1%)
ex.)1.80V → ②=1, =8, =1
: 0.05V increments
Accuracy 1.25V1.95V (±0.02V), 2.054.95V (±1%)
ex.)1.85V → ②=1, =8, =A
: USP-3 (Only XC6501P)
: USP-4
: SSOT-24
: SOT-25
: Embossed tape, standard feed
: Embossed tape, reverse feed

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