UPC324G2 Ver la hoja de datos (PDF) - NEC => Renesas Technology
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UPC324G2 Datasheet PDF : 11 Pages
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µPC324
RECOMMENDED SOLDERING CONDITIONS
The µPC324 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Surface mount device
µPC324G2: 14-pin plastic SOP (5.72 mm (225))
Process
Infrared ray reflow
Vapor Phase Soldering
Wave Soldering
Partial heating method
Conditions
Peak temperature: 230 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time.
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time.
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (Per each side of the device).
Symbol
IR30-00-1
VP15-00-1
WS60-00-1
–
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
Through-hole device
µPC324C: 14-pin plastic DIP (7.62 mm (300))
Process
Wave soldering
(only to leads)
Partial heating method
Conditions
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (per each lead.)
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
Data Sheet G11763EJ4V0DS
9
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