HMC318MS8G Ver la hoja de datos (PDF) - Hittite Microwave

Número de pieza

componentes Descripción

Fabricante

HMC318MS8G

GaAs MMIC LOW NOISE AMPLIFIER with AGC, 5 - 6 GHz

Hittite Microwave 

Outline Drawing

v02.0607

HMC318MS8G / 318MS8GE

GaAs MMIC LOW NOISE AMPLIFIER

with AGC, 5 - 6 GHz

8

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS].

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO

PCB RF GROUND.

Package Information

Part Number

Package Body Material

HMC318MS8G

Low Stress Injection Molded Plastic

Lead Finish

Sn/Pb Solder

HMC318MS8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

MSL Rating

MSL1 [1]

MSL1 [2]

Package Marking [3]

H318

XXXX

H318

XXXX

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

8 - 17

Share Link: