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AS1150 Ver la hoja de datos (PDF) - austriamicrosystems AG

Número de pieza
componentes Descripción
Fabricante
AS1150
AMSCO
austriamicrosystems AG AMSCO
AS1150 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
AS1150, AS1151
Data Sheet
austriamicrosystems
9 Applications
Table 5. Function Table
Enable Pins
EN
ENn
H
L or Open
Other Combinations of Enable Pin Settings
Input
INx+
INx-
VID +100mV
VID +100mV
AS1150 – Open, undriven short, or undriven
100parallel termination
AS1151 – Open or undriven short
Don’t Care
Figure 17. Typical Application Circuit
LVDS
Signals
Tx
107
Rx
Output
OUTx
H
L
H
Z
Tx
LVTTL/LVC-
MOS
Data Inputs
Tx
107
Rx
107
Rx
LVTTL/LVC-
MOS
Data Outputs
Tx
107
Rx
AS1152
Quad LVDS Driver
AS1151
100Shielded Twisted Cable or Microstrip PC Board Traces
Power-Supply Bypassing
To bypass VCC, use high-frequency surface-mount ceramic 0.1µF and 0.001µF capacitors in parallel as close to the
device as possible, with the smaller valued capacitor closest to pin VCC.
Differential Traces
Input trace characteristics can adversely affect the performance of the AS1150 and AS1151.
! Use controlled-impedance PC board traces to match the cable characteristic impedance. The termination resistor
must also be matched to this characteristic impedance.
! Eliminate reflections and ensure that noise couples as common mode by running differential traces close together.
! Reduce skew by using matched trace lengths. Tight skew control is required to minimize emissions and proper
data recovery of the devices.
! Route each channel’s differential signals very close to each other for optimal cancellation of their respective exter-
nal magnetic fields. Use a constant distance between the differential traces to avoid irregularities in differential
impedance.
! Avoid 90° turns (use two 45° turns).
! Minimize the number of vias to further prevent impedance irregularities.
www.austriamicrosystems.com
Revision 1.19
10 - 15

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