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AS1751 Ver la hoja de datos (PDF) - austriamicrosystems AG

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AS1751 Datasheet PDF : 16 Pages
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AS1751, AS1752, AS1753
Data Sheet
austriamicrosystems
4 Absolute Maximum Ratings
Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical
Characteristics on page 3 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 1. Absolute Maximum Ratings
Parameter
V+, INx to GND
Min Max Units
-0.3
+5
V
Comments
COMx, NOx, NCx to GND
-0.3
V+
+ 0.3
V
COMx, NOx, NCx Continuous Current -250 +250 mA
COMx, NOx, NCx Peak Current
-350 +350 mA
Continuous Power
16-pin QFN
Dissipation (TAMB = +70ºC) 14-pin TSSOP
727
mW
1349
Operating Temperature Range
-40
+85
ºC
Electro-Static Discharge
2500 V
Latch Up Immunity
250 mA
Junction Temperature
+150 ºC
Storage Temperature Range
-65 +150 ºC
Pulsed at 1ms 10% duty cycle
Derate at 9.1W/ºC above +70ºC
Derate at 16.9W/ºC above +70ºC
HBM Mil-Std883E 3015.7 methods
Norm: JEDEC 17
Package Body Temperature
+260
The reflow peak soldering temperature (body
temperature) specified is in accordance with
ºC IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”
Signals on pins COM1, COM3, NO1, NO2, NC1, or NC2 that exceed V+ or GND are clamped by internal diodes. For-
ward-diode current should be limited to the maximum current rating.
-
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Revision 1.4
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