SP000219532 Ver la hoja de datos (PDF) - Infineon Technologies

Número de pieza

componentes Descripción

Fabricante

SP000219532

Smart Four Channel Highside Power Switch for Industrial Applications

Infineon Technologies 

PROFET® ITS711L1

Maximum Ratings at Tj = 25°C unless otherwise specified

Parameter

Supply voltage (overvoltage protection see page 4)

Supply voltage for full short circuit protection

Tj,start = -40 ...+150°C

Load current (Short-circuit current, see page 5)

Load dump protection2) VLoadDump = UA + Vs, UA = 13.5 V

RI3) = 2 Ω, td = 200 ms; IN = low or high,

each channel loaded with RL = 7.1 Ω,

Junction temperature

Operating temperature range

Storage temperature range

Power dissipation (DC)5

Ta = 25°C:

(all channels active)

Ta = 85°C:

Inductive load switch-off energy dissipation, single pulse

Vbb = 12V, Tj,start = 150°C5),

IL = 1.9 A, ZL = 66 mH, 0 Ω

one channel:

IL = 2.8 A, ZL = 66 mH, 0 Ω

two parallel channels:

IL = 4.4 A, ZL = 66 mH, 0 Ω

four parallel channels:

see diagrams on page 9 and page 10

Electrostatic discharge capability (ESD)

(Human Body Model)

Input voltage (DC)

Current through input pin (DC)

Current through status pin (DC)

see internal circuit diagram page 8

Symbol

Vbb

Vbb

IL

VLoad

dump4)

Tj

Ta

Tstg

Ptot

EAS

VESD

VIN

IIN

IST

Thermal resistance

junction - soldering point5),6)

junction - ambient5)

each channel: Rthjs

one channel active: Rthja

all channels active:

Values Unit

43 V

34 V

self-limited A

60 V

+150 °C

-30 ... +85

-40 … +105

3.6 W

1.9

150 mJ

320

800

1.0 kV

-10 ... +16 V

±2.0 mA

±5.0

16 K/W

44

35

2) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a

150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for input

protection is integrated.

3) RI = internal resistance of the load dump test pulse generator

4) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839

5) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb

connection. PCB is vertical without blown air. See page 15

6) Soldering point: upper side of solder edge of device pin 15. See page 15

Infineon Technologies AG

3

2006-Mar-23

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