TDA2003 Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
TDA2003 Datasheet PDF : 10 Pages
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TDA2003
PRATICAL CONSIDERATION
Printed circuit board
The layout shown in fig. 17 is recommended. If
different layouts are used, the ground points of
input 1 and input 2 must be well decoupled from
the ground of the output through which a ratherhigh
current flows.
Assembly suggestion
No electrical insulation is required between the
packageand the heat-sink.Pin length should be as
short as possible. The soldering temperature must
not exceed 260°C for 12 seconds.
Application suggestions
The recommended component values are those
shown in the application circuits of fig.16.
Different values can be used. The following table is
intended to aid the car-radio designer.
Compon ent
C1
C2
C3
C4
C5
CX
R1
R2
R3
RX
Recommmended
value
Purpose
2.2 µF
Input DC
decoupling
470 µF
Ripple rejection
0.1 µF
Supply bypassing
1000 µF
Output coupling to load
0.1 µF
Frequency stability
≅
2
π
1
B
R1
(Gv-1) • R2
2.2 Ω
1Ω
Upper frequency cutoff
Setting of gain
Setting of gain
and SVR
Frequency stability
≅ 20 R2
Upper frequency cutoff
Larger than
Smaller than
recommended value recommended value C1
Noise at switch-on,
switch-off
Degradation of SVR
Danger of oscillation
Higher low frequency
cutoff
Danger of oscillation at
high frequencies with
inductive loads
Lower bandwidth
Larger bandwidth
Degradation of SVR
Increase of drain current
Danger of oscillation at
high frequencies with
inductive loads
Poor high frequency
attenuation
Danger of oscillation
8/10
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