S16MD01 Ver la hoja de datos (PDF) - Sharp Electronics
Número de pieza
componentes Descripción
Fabricante
S16MD01 Datasheet PDF : 4 Pages
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Fig.11 Turn-on Time vs. Forward Current
(S16MD02/S26MD02)
20
VD = 6V
RL= 100Ω
Ta= 25˚C
10
S16MD01/S16MD02/S26MD01/S26MD02
Fig.12 Zero-cross Voltage vs.
Ambient Temperature
(S16MD02/S26MD02)
Load : R
IF= 15mA
25
5
20
4
3
2
10
20
30 40 50
Forward current I F ( mA )
s Basic Operation Circuit
R1
+ VCC
2
8
D1
SSR
15
100
- 30
0 20 40 60 80 100
Ambient temperature T a (˚C)
Load
ZS
AC 100V (S16MD01/S16MD02)
AC 200V (S26MD01/S26MD02)
VI
Tr1
3
6
ZS : Surge absorption circuit
(1) DC Drive
(2) Pulse Drive
(3) Phase Control
AC supply voltage
Input signal
Load current
(for resistance load)
Notes 1 ) If large amount of surge is loaded onto V CC or the driver circuit, add a diode D 1 between terminal 2
and 3 to prevent reverse bias from being applied to the infrared LED.
2 ) Be sure to install a surge absorption circuit.
An appropriate circuit must be chosen according to the load ( for CR, choose its constant ) . This must be
carefully done especially for an inductive load.
3 ) For phase control, adjust such that the load current immediately after the input signal is applied will be
more than 30mA.
s Precautions for Use
1) All pins must be soldered since they are also used as heat sinks ( heat radiation fins) . In
designing, consider the heat radiation from the mounted SSR.
2) For higher radiation efficiency that allows wider thermal margin, secure a wider round
pattern for Pin No.8 when designing mounting pattern. The rounded part of Pin No.5 ( gate )
must be as small as possible. Pulling the gate pattern around increases the change of being
affected by external noise.
3) As for other general cautions, refer to the chapter“Precautions for Use”
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