Exposed Pad
W≦2.28mm
Figure 12. Dog-Bone Layout
RT9045
As shown in Figure 13, the amount of copper area to which
the SOP-8 (Exposed Pad) is mounted affects thermal
performance. When mounted to the standard SOP-8
(Exposed Pad) pad of 2 oz. copper (Figure 13.a), θJA is
86°C/W. Adding copper area of pad under the SOP-8
(Exposed Pad) (Figure 13.b) reduces the θJA to 73°C/W.
Even further, increasing the copper area of pad to 70mm2
(Figure 13.d) reduces the θJA to 65°C/W.
(a) Copper Area = 10mm2, θJA = 86°C/W
(b) Copper Area = 30mm2, θJA = 73°C/W
(c) Copper Area = 50mm2, θJA = 68°C/W
(d) Copper Area = 70mm2, θJA = 65°C/W
Figure 13. Thermal Resistance vs. Copper Area Layout
Thermal Design
DS9045-04 August 2011
www.richtek.com
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