FSQ100 Ver la hoja de datos (PDF) - Fairchild Semiconductor
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FSQ100 Datasheet PDF : 12 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. TA = 25°C, unless otherwise specified.
Symbol
Parameter
Value
Unit
VDRAIN
Drain Pin Voltage
650
V
VSTR
Vstr Pin Voltage
650
V
VDG
Drain-Gate Voltage
650
V
VGS
Gate-Source Voltage
±20
V
VCC
Supply Voltage
20
V
VFB
Feedback Voltage Range
-0.3 to VSTOP
V
PD
Total Power Dissipation
1.40
W
TJ
Operating Junction Temperature
Internally limited
°C
TA
Operating Ambient Temperature
-25 to +85
°C
TSTG
Storage Temperature
-55 to +150
°C
Notes:
1. Repetitive rating: Pulse width is limited by maximum junction temperature.
2. L = 24mH, starting TJ = 25°C.
Thermal Impedance
TA = 25°C, unless otherwise specified. All items are tested with the JEDEC standards JESD 51-2 and 51-10 (DIP).
Symbol
Parameter
Value
Unit
θJA
Junction-to-Ambient Thermal Impedance(3)
88.84
°C/W
θJC
Junction-to-Case Thermal Impedance(4)
13.94
°C/W
Notes:
3. Free-standing with no heatsink; without copper clad. Measurement condition – just before junction temperature
TJ enters into OTP.
4. Measured on the DRAIN pin close to plastic interface.
© 2007 Fairchild Semiconductor Corporation
FSQ100 Rev. 1.0.1
4
www.fairchildsemi.com
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