LSM670-H2J2-1 Ver la hoja de datos (PDF) - OSRAM GmbH
Número de pieza
componentes Descripción
Fabricante
LSM670-H2J2-1 Datasheet PDF : 13 Pages
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LS M670, LO M670, LY M670, LG M670, LP M670
Empfohlenes Lötpaddesign IR Reflow Löten
Recommended Solder Pad IR Reflow Soldering
2.8 (0.110)
0.8 (0.031)
2.8 (0.110)
0.8 (0.031)
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation
Cu-Fläche > 16 mm 2
Cu-area > 16 mm 2
Lötstopplack
Solder resist
OHLPY978
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2001-03-15
11
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