UPC2800 Ver la hoja de datos (PDF) - NEC => Renesas Technology

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componentes Descripción

Fabricante

UPC2800

PREAMPLIFIER FOR INFRARED REMOTE CONTROL

NEC => Renesas Technology 

µPC2800A

7. RECOMMENDED SOLDERING CONDITIONS

Solder this product under the following recommended conditions.

For details of the recommended soldering conditions, refer to information document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended, consult NEC.

Surface Mount Type

µPC2800AGR: 8-pin plastic SOP (225 mil)

Process

Conditions

Infrared ray reflow

Peak temperature: 230 °C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210 °C or higher),

Maximum number of reflow processes: 1 time.

VPS

Peak temperature: 215 °C or below (Package surafce temperature),

Reflow time: 40 seconds or less (at 200 °C or higher),

Maximum number of reflow processes: 1 time.

Wave soldering

Solder temperature: 260 °C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120 °C or below (Package surface temperature).

Partial heating method Pin temperature: 300 °C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR30-00-1

VP15-00-1

WS60-00-1

–

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”,

or the device will be damaged by heat stress.

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