AN7523N Ver la hoja de datos (PDF) - Panasonic Corporation
Número de pieza
componentes Descripción
Fabricante
AN7523N Datasheet PDF : 9 Pages
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Prepared
Checked
Approved
Product Specifications
AN7523N
Ref No.
F-1
Total Page
9
Page No.
7
(Structure Description)
Chip surface passivation SiN,
PSG,
Others (
Lead frame material
Fe group,
Cu group,
Others (
Inner lead surface process Ag plating,
Au plating,
Others (
Outer lead surface process Solder plating, Solder dip,
Others (
Chip mounting method Ag paste,
Au-Si alloy, Solder, Others (
Wire bonding method
Thermalsonic bonding,
Others (
Wire material, Diameter Au,
Diameter 30 µm Others (
Mold material
Epoxy,
Others (
Molding method
Transfer mold, Multiplunger mold, Others (
)1
) 2, 6
)2
)6
)3
)4
)4
)5
)5
Package 9-SIP(F)
1
2
3
4
5
6
Eff. Date Eff. Date Eff. Date
25-APR-2000 21-JUL-2000
FMSC-PSDA-002-01
Eff. Date
Matsushita Electronics Corporation
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