IS1677SM Ver la hoja de datos (PDF) - Unspecified

Número de pieza

componentes Descripción

Fabricante

IS1677SM

Bluetooth® 4.0 Dual Mode Module

Unspecified 

RN4677

1.12 Mounting Details

The RN4677 physical dimensions are shown in

Figure 1-6, recommended host PCB footprint in

Figure 1-7, and mounting suggestion in Figure 1-8. No

top copper layer must be near the test pin area as

shown in Figure 1-7. When laying out the host PCB, the

areas under the antenna must not contain any top,

inner layer, or bottom copper as shown in Figure 1-8. A

low-impedance ground plane ensures best radio

performance (best range; lowest noise). Figure 1-8

also shows a minimum ground plane area to the left

and right of the module for best antenna performance.

The ground plane can be extended beyond the

minimum recommended, see Figure 1-7, as required

for host PCB EMC noise reduction. For best range

performance, keep all external metal away from the

ceramic chip antenna at least 31 mm.

1.13 Soldering Recommendations

The RN4677 wireless module was assembled using

standard lead-free reflow profile IPC/JEDEC J-STD-

020.

The module can be soldered to the host PCB using

standard leaded and lead-free solder reflow profiles.

To avoid damaging the module, the following

recommendations are given:

• Microchip Technology Application Note “AN233

Solder Reflow Recommendation” (DS00233)

provides solder reflow recommendations

• Do not exceed peak temperature (TP) of 250°C

Refer to the solder paste data sheet for specific

reflow profile recommendations

• Use no-clean flux solder paste

• Do not wash as moisture can be trapped under

the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow.

FIGURE 1-6:

RN4677 MODULE DIMENSIONS

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 2015 Microchip Technology Inc.

Advance Information

DS50002370A-page 9

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