SC16IS760 Ver la hoja de datos (PDF) - NXP Semiconductors.

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componentes Descripción

Fabricante

SC16IS760

Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support

NXP Semiconductors. 

NXP Semiconductors

SC16IS740/750/760

Single UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR

4. Ordering information

Table 1. Ordering information

Type number

Package

Name

SC16IS740IPW

TSSOP16

SC16IS740IPW/Q900[1] TSSOP16

SC16IS750IBS

HVQFN24

SC16IS750IPW

SC16IS760IBS

TSSOP24

HVQFN24

SC16IS760IPW

TSSOP24

Description

Version

plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

plastic thermal enhanced very thin quad flat package; no leads;

24 terminals; body 4  4  0.85 mm

SOT616-3

plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1

plastic thermal enhanced very thin quad flat package; no leads;

24 terminals; body 4  4  0.85 mm

SOT616-3

plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1

[1] SC16IS740IPW/Q900 is AEC-Q100 compliant. Contact interface.support@nxp.com for PPAP.

SC16IS740_750_760

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 7 — 9 June 2011

© NXP B.V. 2011. All rights reserved.

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