21207 Ver la hoja de datos (PDF) - Unspecified

Número de pieza

componentes Descripción

Fabricante

21207

BGA & CSP Rework System

Unspecified 

Main Unit Components - Figure 1

11. Open Frame adjustable printed circuit board holder.

12. Main Power Switch.

13. Subzone heater, heat/cool selector switch.

14. BGA-3528 Micro Oven Head Assembly

15. Z-Axis Adjustment Lever – Rotating Clockwise will raise the head assembly, while rotating

counter clockwise will lower the head assembly.

16. Component Pick-up Solenoid – When engaged, the vacuum is set to automatically raise the

component after reflow.

III. SYSTEM FUNCTIONS

BGA/CSP-3500 SYSTEM - Figure 1 (page 7)

17. Vacuum Cup Height Lock – After the lift solenoid has been armed, this knob locks the vacuum cup

into position on the component to be removed.

18. Quick-change Nozzle Release / Lock Mechanism

19. Nozzle Rotation Knob – Adjusts the angle at which the nozzle sits in reference to the component

10. Board Holder Position Locking Knob – When placing a component, pull this knob towards you

and slide the board holder until it locks securely underneath the Placement arm or reflow head.

11. Underboard Support Assembly– Provides support to the printed circuit board and reduces any

potential of PCB warpage or bowing. Adjust the 4 thumbscrews on the underboard support until

they contact the bottom of the PCB and provide support.

This underboard support is constructed of a special material that reduces the absorption of heat,

however, in some instances it may interfere with the transfer of heat energy from the underboard

heater. Please position it away from the component under rework.

12. X-Axis Lock / Unlock Bar – Set into the “horizontal” position to unlock the X-Axis to make coarse

adjustments, and then set into the “vertical” position to lock the X-Axis to make fine adjustments

using the micrometer.

13. Y-Axis Lock / Unlock Bar – Set into the “horizontal” position to unlock the Y-Axis to make coarse

adjustments, then set into the “vertical” position to lock the Y-Axis to make fine adjustments using

the micrometer.

14. X-Axis Micrometer - Used to make fine adjustments to the X-Axis.

15. Y-Axis Micrometer - Used to make fine adjustments to the Y-Axis.

16. Vacuum Contact LED – Illuminates when the removal vacuum is activated AND the vacuum pad is

in contact with the component.

17. Component Illumination Knob –Varies the amount of light directed to the bottom side terminals of

the component. This adjustment affects the illumination of the component viewed on the monitor.

18. PCB Illumination Knob - Varies the amount of light directed to the top of the PCB. This adjustment

affects the illumination of the PCB pads viewed on the monitor.

6

BGA-3500 Series Manual 5/01

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