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301K Datasheet PDF : 7 Pages
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Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
431 AND 433 SERIES High-Performance Heat Sinks for 30-100W Metal Power Semiconductors
TO-3; Stud-Mount
Standard
P/N
431K
433K ̆
Nominal Dimensions
Width
Length “A”
Height
Semiconductor
in. (mm)
in. (mm)
in. (mm) Mounting Hole Pattern
4.750 (120.7) 3.000 (76.2) 3.000 (76.2)
4.750 (120.7) 5.500 (139.7) 3.000 (76.2)
None
None
Thermal Performance at Typical Load
Natural Convection Forced Convection
55°C @ 5OW
42°C @ 5OW
0.40°C/W @ 250 LFM
0.28°C/W @ 250 LFM
Weight
lbs. (grams)
0.7800 (353.81)
1.4900 (675.86)
Need maximum heat dissipation from a TO-3 rectifier heat sink in
minimum space? The Wakefield 431 and 433 Series center chan-
nel double-surface heat sinks offer the highest performance-to-weight ratio for minimum vol-
ume occupied for TO-3, diode, and stud-mount metal power semiconductors in the 30- to
100-watt operating range. Additional interface resistance reduction for maximized overall per-
formance can be achieved with proper application of Wakefield Type 126 silicone-free thermal
compound. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SERIES
431
433
431 AND 433
SERIES
(EXTRUSION
PROFILE 2726)
SEMICONDUCTOR
MOUNTING HOLE
K
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
435 SERIES Lightweight Quadruple Mount Heat Sink for TO-3 Case Styles
Standard
P/N
Nominal Dimensions
Width
Length
Height
in. (mm)
in. (mm)
in. (mm)
Semiconductor
Thermal Performance at Typical Load
Mounting Hole Pattern Natural Convection Forced Convection
435AAAA 4.250(108.0) 5.500(139.7) 4.300(109.2)
(4) TO-3
37°C @ 50W 0.38°C/W @ 250 LFM
54°C @ 80W 0.24°C/W @ 600 LFM
TO-3
Weight
lbs. (grams)
1.1500 (521.64)
This lightweight high-performance heat sink is designed to
mount and cool efficiently one to four TO-3 style metal case
power semiconductors. The Type 435AAAA is the standard configuration available from stock,
predrilled for mounting four TO-3 style devices. Increased performance can be achieved with
the proper selection and installation of a Wakefield Type 175 DeltaPad Kapton™ interface
material for each power semiconductor or, for maximum reduction of case-to-sink interface
loss, the application of Wakefield Type 126 silicone-free thermal compound. Material:
Aluminum Alloy, Black Anodized.
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
SEMICONDUCTOR
MOUNTING HOLES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AAAA
435 SERIES
(EXTRUSION
PROFILE 4226)
441 SERIES High-Performance Natural Convection Heat Sinks for Rectifiers and Diodes
Standard
P/N
441K ̆
Nominal Dimensions
Width
Length
Height
in. (mm) in. (mm) in. (mm)
4.750 (120.7) 5.500 (139.7) 4.500 (114.3)
Semiconductor
Mounting Hole Pattern
None
Thermal Performance at Typical Load
Natural Convection Forced Convection
34°C @ SOW 0.30°C/W @ 250 LFM
47°C @ 80W 0.19°C/W @ 600 LFM
Stud-Mount
Weight
lbs. (grams)
1.9700 (893.59)
Designed for vertical mounting within a power supply enclosure
or equipment cabinet without forced airflow available. This
Wakefield 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection
with a maximum 55°C heat sink temperature rise above ambient. When applied in a forced
convection environment, the 441K Type will achieve thermal resistance of 0.18°C/W (sink to
ambient) at 1000 LFM. Supplied with no predrilled device mounting hole pattern. Material:
Aluminum Alloy, Black Anodized.
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
SEMICONDUCTOR
MOUNTING HOLE
K
441 SERIES
(EXTRUSION
PROFILE 1273)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
All other products, please contact factory for price, delivery, and minimums.
52
̆ Normally stocked
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