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301K Datasheet PDF : 7 Pages
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Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
401 AND 403 SERIES Double-Surface Heat Sinks for TO-3 Case Styles
TO-3; Stud-Mount
Standard
P/N
401A ̆
401F
401K ̆
403A ̆
403F ̆
403K ̆
Width
in. (mm)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
Overall Dimensions Height
in. (mm)
in. (mm)
1.500 (38.1)
1.500 (38.1)
1.500 (38.1)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks
are recommended for critical space applications where maximum heat dissipation is required
for high-power TO-3 case styles. Forced convection performance is also exemplary with these
double surface fin types. Semiconductor mounting hole style “F” offers a single centered
Semiconductor
Thermal Performance at Typical Load
Mounting Hole Pattem Natural Convection Forced Convection
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
80°C @ 30W
80°C @ 30W
80°C @ 30W
55°C @ 30W
55°C @ 30W
55°C @ 30W
1.5° C/W @ 250 LFM
1.5° C/W @ 250 LFM
1.5° C/W @ 250 LFM
0.9° C/W @ 250 LFM
0.9° C/W @ 250 LFM
0.9° C/W @ 250 LFM
Weight
lbs. (grams)
0.1500 (68.04)
0.1500 (68.04)
0.1500 (68.04)
0.3500 (158.76)
0.3500 (158.76
0.3500 (158.76)
0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize)
for mounting stud-type diodes and rectifiers. Hole pattem “V" available upon request.
Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
403 SERIES
Dimensions: in. (mm)
A
401 SERIES
SEMICONDUCTOR MOUNTING HOLES
F
K
V
401 AND 403 SERIES
(EXTRUSION
PROFILE 1024)
413/421/423 SERIES Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes
TO-3; DO-5; Stud-Mount
Standard
P/N
413A
413F
413K ̆
421A
421F
421K ̆
423A
423K ̆
Width
in. (mm)
Nominal Dimensions
Length
Height “A”
in. (mm)
in. (mm)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
5.500 (140.2)
5.500 (140.2)
1.875 (47.6)
1.875 (47.6)
1.875 (47.6)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
Semiconductor
Thermal Performance at Typical Load
Mounting Hole Pattern Natural Convection Forced Convection
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
None
72° C @ 50W
72° C @ 50W
72° C @ 50W
58° C @ 50W
58° C @ 50W
58° C @ 50W
47° C @ 50W
47° C @ 50W
0.85° C/W @ 250 LFM
0.85° C/W @ 250 LFM
0.85° C/W @ 250 LFM
0.7° C/W @ 250 LFM
0.7° C/W @ 250 LFM
0.7° C/W @ 250 LFM
0.5° C/W @ 250 LFM
0.5° C/W @ 250 LFM
Weight
lbs. (grams)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
1.1700 (530.71)
1.1700 (530.71)
Space-saving double surface 413, 421, and 423 Series utilize finned surface
area on both sides of the power semiconductor mounting surface to provide
maximum heat dissipation in a compact profile. Ready to install on popular
power components in natural and forced convection applications. Apply
Wakefield Type 126 silicone-free thermal compound or Wakefield DeltaPad™
interface materials for maximum performance. Material: Aluminum Alloy, Black
Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
413 SERIES
(EXTRUSION
PROFILE 2276
421 SERIES
(EXTRUSION
PROFILE 1025)
A
SERIES
413
421
Dimensions: in. (mm)
̆ Normally stocked
423 SERIES
(EXTRUSION PROFILE 1025)
SEMICONDUCTOR MOUNTING HOLES
F
K
V
51
All other products, please contact factory for price, delivery, and minimums.
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