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Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
621 AND 623 SERIES Low-Profile Heat Sinks for All Metal-Case Power Semiconductors
TO-3
Standard
P/N
621A
621K
623A
623K
Footprint
Dimensions
in. (mm)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 3.000 (76.2)
4.750 (120.6) x 3.000 (76.2)
Height
in. (mm)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
Mounting
Hole Pattern
(1) TO-3
None
(1) TO-3
None
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
75°C @ 15W
75°C @ 15W
52°C @ 15W
52°C @ 15W
2.0°C/W @ 250 LFM
2.0°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
Weight
lbs. (grams)
0.1000 (45.36)
0.1000 (45.36)
0.2100 (95.26)
0.210O (95.26)
A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case
power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find
a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.)
in width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the
standard TO-3 package. Material: Aluminum Alloy, Black Anodized.
MECHANICAL
DIMENSIONS
621 AND 623 SERIES (EXTRUSION PROFILE 1327)
SEMICONDUCTOR MOUNTING HOLES
A
K
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
301/302/303 SERIES Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases
STUD-MOUNT
Standard
P/N
Outline
Dimensions
in. (mm)
Length “A”
in. (mm)
Mounting
Hole (s)
Pattern and Number
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
Weight
lbs. (grams)
301K
2.000 (50.8) x 2.000 (50.8)
301M 2.000 (50.8) x 2.000 (50.8)
301N
2.000 (50.8) x 2.000 (50.8)
302M 2.000 (50.8) x 2.000 (50.8)
302MM 2.000 (50.8) x 2.000 (50.8)
302N 2.000 (50.8) x 2.000 (50.8)
302NN ̆ 2.000 (50.8) x 2.000 (50.8)
303M 2.000 (50.8) x 2.000 (50.8)
303MM 2.000 (50.8) x 2.000 (50.8)
303N ̆ 2.000 (50.8) x 2.000 (50.8)
303NN 2.000 (50.8) x 2.000 (50.8)
0.750 (19.1)
None
0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth
0.750 (19.1)
(1)
⁄1
4
-28UNF,
0.625
in.
thread
depth
1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth
1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth
1.500 (38.1)
(1)
⁄1
4
-28UNF,
0.625
in.
thread
depth
1.500 (38.1)
(2)
⁄1
4
-28UNF,
0.625
in.
thread
depth
3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth
3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth
3.000 (76.2)
(1)
⁄1
4
-28UNF,
0.625
in.
thread
depth
3.000 (76.2)
(2)
⁄1
4
-28UNF,
0.625
in.
thread
depth
70°C @ 15W
70° C @ 15W
70° C @ 15W
50° C @ 15W
50°C @ 15W
5O°C @ 15W
50°C @ 15W
37° C @ 15W
37° C @ 15W
37° C @ 15W
37° C @ 15W
2.5° C/W @ 250 LFM
2.5° C/W @ 250 LFM
2.5° C/W @ 250 LFM
1.8° C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8° C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.3° C/W @ 250 LFM
1.3° C/W @ 250 LFM
1.3° C/W @ 250 LFM
1.3° C/W @ 250 LFM
0.0580 (26.31)
0.0580 (26.31)
0.0580 (26.31)
0.1330 (60.33)
0.1330 (6033)
0.1330 (60.33)
0.1330 (60.33)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
The large fin area in minimum total volume provided by the radial design of the 301/302/303
Series offers maximum heat transfer efficiency in natural convection. All types are available
with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the
302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and
“NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black
Anodized.
MECHANICAL
DIMENSIONS
SEMICONDUCTOR MOUNTING HOLES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
K
M
N
Dimensions: in. (mm) 301 SERIES
302 AND 303 SERIES
SERIES
301
302
303
641 SERIES Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Standard
P/N
641A ̆
641K ̆
Outline
Dimensions
in. (mm)
4.125 (104.8) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
Height
in. (mm)
1.000 (25.4)
1.000 (25.4)
Mounting
Hole
Pattern
(1) TO-3
None
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
36°C @ 15W 0.9°C/W @ 250 LFM
36°C @ 15W 0.9°C/W @ 250 LFM
TO-3
Weight
lbs. (grams)
0.2900 (131.54)
0.2900 (131.54)
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
tion with an optimized heat sink surface area. The 641K type with an open channel area of
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black
Anodized.
MECHANICAL
DIMENSIONS
641 SERIES
(EXTRUSION PROFILE 1371)
SEMICONDUCTOR MOUNTING HOLES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
A
K
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
50
̆ Normally stocked
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