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LNK6404 Ver la hoja de datos (PDF) - Unspecified

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LNK6404 Datasheet PDF : 18 Pages
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LNK64x4-64x8
Absolute Maximum Ratings(1,5)
DRAIN Voltage .........................................................-0.3 V to 725 V
DRAIN Pin Peak Current: LNK64x4............................. 400 (600) mA(4)
LNK64x5..............................504 (750) mA(4)
LNK64x6 .............................654 (980) mA(4)
LNK64x7............................ 670 (1003) mA(4)
LNK64x8............................ 718 (1076) mA(4)
Peak Negative Pulsed Drain Current................................... -100 mA(2)
FEEDBACK Pin Voltage .................................................. -0.3 to 9 V(6)
FEEDBACK Pin Current..........................................................100 mA
BYPASS Pin Voltage......................................................... -0.3 to 9 V
BYPASS Pin Current................................................................10 mA
Storage Temperature .................................................. -65 to 150 °C
Operating Junction Temperature(7)................................ -40 to 150 °C
Lead Temperature...............................................................260 °C(3)
Notes:
1. All voltages referenced to SOURCE, TA = 25 °C.
2. Duration not to exceed 2 ms.
3. 1/16 in. from case for 5 seconds.
4. The higher peak DRAIN current is allowed while the DRAIN voltage
is simultaneously less than 400 V.
5. Maximum ratings specified may be applied, one at a time without
causing permanent damage to the product. Exposure to Absolute
Maximum ratings for extended periods of time may affect product
reliability.
6. -1 V for current pulse ≤5 mA out of the pin and a duration
of ≤500 ns.
7. Normally limited by internal circuitry.
Thermal Resistance
Thermal Resistance: D Package:
(qJA) .............................. 100 °C/W(2), 80 °C/W(3)
(qJC)(1)................................................ 30 °C/W
E Package
(qJA)...................................... 105 °C/W(4)
(qJC)..........................................2 °C/W(5)
K Package
(qJA) ...................... 45 °C/W(6), 38 °C/W(7)
(qJC)..........................................2 °C/W(5)
Notes:
1. Measured on pin 8 (SOURCE) close to plastic interface.
2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.
3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
4. Free standing with no heat sink.
5. Measured at the back surface of tab.
6. Soldered (including exposed pad for K package) to typical
application PCB with a heat sinking area of 0.36 sq. in.
(232 mm2), 2 oz. (610 g/m2) copper clad.
7. Soldered (including exposed pad for K package) to typical
application PCB with a heat sinking area of 1 sq. in. (645 mm2),
2 oz. (610 g/m2) copper clad.
Parameter
Symbol
Control Functions
Programmable
Maximum Frequency
fOSC
Minimum Operation
Frequency
fOSC(MIN)
Frequency Ratio
(Constant Current)
Frequency Ratio
(Inductance
Correction)
Frequency Jitter
Maximum Duty Cycle
fRATIO(CC)
fRATIO(IC)
DCMAX
FEEDBACK Pin Voltage
VFBth
Conditions
SOURCE = 0 V; TJ = 0 to 100 °C
(Unless Otherwise Specified)
TJ = 25 °C
tON × IFB = 1.4 mA-ms
See Notes A, F
VFB = VFBth
TJ = 25 °C
VFB = VFBth
LNK64x4-64x6
LNK64x7
LNK64x8
TJ = 25 °C
Between VFB = 1.3 V and VFB = 1.9 V
Between tON × IFB = 1.4 mA and
tON × IFB = 2 mA-ms
Peak-to-Peak Jitter Compared to Average
Frequency, TJ = 25 °C
See Notes D, E
TJ = 25 °C
CBP = 1 mF
LNK6404/6405/
6406/6446
LNK6415/6416
Min
Typ
Max Units
85
kHz
350
760
Hz
560
1.42
1.47
1.53
1.16
1.21
1.26
±7
%
55
%
1.915
1.940
1.965
V
1.955
1.980
2.005
8
Rev. C 03/16
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