PACDN1404CG(2017) Ver la hoja de datos (PDF) - ON Semiconductor
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PACDN1404CG Datasheet PDF : 5 Pages
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PACDN1404
APPLICATION INFORMATION
Parameter
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser Cut, 5% Tapered Walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance − Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Maximum Soldering Temperature for Lead−free Devices Using a Lead−free Solder Paste
Value
0.240 mm
Round
Non−Solder Mask Defined Pads
0.290 mm Round
0.125 mm − 0.150 mm
0.300 mm Round
50/50 by Volume
No Clean
OSP (Entek Cu Plus 106A)
±50 mm
±20 mm
60 seconds
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 1. Recommended Non−Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 2. Lead−free (SnAgCu) Solder Ball Reflow Profile
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