MX25L6406EM2I-12G Ver la hoja de datos (PDF) - Macronix International

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MX25L6406EM2I-12G

64M-BIT [x 1 / x 2] CMOS SERIAL FLASH

Macronix International 

MX25L6406E

10-20. Read SFDP Mode (RDSFDP).................................................................................................................. 24

Figure 3. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence................................................... 24

Table 8. Signature and Parameter Identification Data Values .......................................................................... 25

Table 9. Parameter Table (0): JEDEC Flash Parameter Tables........................................................................ 26

Table 10. Parameter Table (1): Macronix Flash Parameter Tables................................................................... 28

11. POWER-ON STATE.............................................................................................................................................. 30

12. ELECTRICAL SPECIFICATIONS......................................................................................................................... 31

12-1. Absolute Maximum Ratings........................................................................................................................ 31

Figure 4. Maximum Negative Overshoot Waveform......................................................................................... 31

12-2. Capacitance............................................................................................................................................... 31

Figure 5. Maximum Positive Overshoot Waveform........................................................................................... 31

Figure 6. Input Test Waveforms and Measurement Level................................................................................. 32

Figure 7. Output Loading.................................................................................................................................. 32

Table 11. DC Characteristics............................................................................................................................. 33

Table 12. AC Characteristics............................................................................................................................. 34

13. Timing Analysis................................................................................................................................................... 35

Figure 8. Serial Input Timing............................................................................................................................. 35

Figure 9. Output Timing..................................................................................................................................... 35

Figure 10. Hold Timing...................................................................................................................................... 36

Figure 11. WP# Disable Setup and Hold Timing during WRSR when SRWD=1.............................................. 36

Figure 12. Write Enable (WREN) Sequence (Command 06)............................................................................ 37

Figure 13. Write Disable (WRDI) Sequence (Command 04)............................................................................. 37

Figure 14. Read Status Register (RDSR) Sequence (Command 05)............................................................... 38

Figure 15. Write Status Register (WRSR) Sequence (Command 01).............................................................. 38

Figure 16. Read Data Bytes (READ) Sequence (Command 03)..................................................................... 38

Figure 17. Read at Higher Speed (FAST_READ) Sequence (Command 0B)................................................. 39

Figure 18. Dual Output Read Mode Sequence (Command 3B)........................................................................ 40

Figure 19. Sector Erase (SE) Sequence (Command 20)................................................................................. 40

Figure 20. Block Erase (BE) Sequence (Command 52 or D8)......................................................................... 40

Figure 21. Chip Erase (CE) Sequence (Command 60 or C7).......................................................................... 41

Figure 22. Page Program (PP) Sequence (Command 02).............................................................................. 41

Figure 23. Deep Power-down (DP) Sequence (Command B9)....................................................................... 42

Figure 24. Release from Deep Power-down (RDP) Sequence (Command AB).............................................. 42

Figure 25. Read Electronic Signature (RES) Sequence (Command AB)......................................................... 42

Figure 26. Read Identification (RDID) Sequence (Command 9F)..................................................................... 43

Figure 27. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90)............................ 43

Figure 28. Read Security Register (RDSCUR) Sequence (Command 2B)....................................................... 44

Figure 29. Write Security Register (WRSCUR) Sequence (Command 2F)...................................................... 44

Figure 30. Program/ Erase flow with read array data........................................................................................ 45

Figure 31. Power-up Timing.............................................................................................................................. 46

Table 13. Power-Up Timing .............................................................................................................................. 46

P/N: PM1577

REV. 1.8, NOV. 12, 2013

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