NCV1117ST12T3G(2004) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Fabricante
NCV1117ST12T3G
(Rev.:2004)
(Rev.:2004)
ON Semiconductor
NCV1117ST12T3G Datasheet PDF : 16 Pages
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NCP1117, NCV1117
14.5
13.5
20
0
−20
0
Cin = 1.0 mF
Cout = 10 mF
Iout = 0.1 A
TA = 25°C
0.1
0
−0.1
0.5
0
40
80
120
160
200
0
t, TIME (ms)
Figure 16. NCP1117XT12 Line
Transient Response
Cin = 10 mF
Cout = 10 mF
Vin = 13.5 V
Preload = 0.1 A
TA = 25°C
40
80
120
160
200
t, TIME (ms)
Figure 17. NCP1117XT12 Load
Transient Response
180
1.6
160
140
120
Minimum
Size Pad
100
80
60
0
5.0
PD(max) for TA = 50°C
1.4
1.2
2.0 oz. Copper
L
ÎÎÎÎÎÎÎÎÎ L
1.0
0.8
0.6
RqJA
0.4
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 18. SOT−223 Thermal Resistance and Maximum
Power Dissipation vs. P.C.B. Copper Length
100
1.6
PD(max) for TA = 50°C
90
1.4
80
Minimum
70
Size Pad
60
2.0 oz. Copper
L
1.2
ÎÎÎÎ1.0
ÎÎÎÎ L
ÎÎÎÎÎÎÎÎ0.8
50
0.6
RqJA
40
0.4
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 19. DPAK Thermal Resistance and Maximum
Power Dissipation vs. P.C.B. Copper Length
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