LT8580 Ver la hoja de datos (PDF) - Linear Technology

Número de pieza

componentes Descripción

Fabricante

LT8580

Boost/SEPIC/Inverting DC/DC Converter with 1A, 65V Switch, Soft-Start and Synchronization

Linear Technology 

LT8580

Applications Information

1

C1

2

VIN

3

L1

4

SW

D1 C2

VOUT

GND

8

9

7

6

5

SYNC

SHDN

8580 F10

VIAS TO GROUND

PLANE REQUIRED

TO IMPROVE

THERMAL

PERFORMANCE

Figure 10. Suggested Component Placement for Boost Topology

(Both DFN and MSOP Packages. Not to Scale). Pin 9 (Exposed

Pad) Must Be Soldered Directly to the Local Ground Plane for

Adequate Thermal Performance. Multiple Vias to Additional

Ground Planes Will Improve Thermal Performance

GND

C1

VIN

L1

SW

1

8

2

9

7

3

6

4

5

SYNC

SHDN

L2

C2

D1 C3

VOUT

8580 F11

VIAS TO GROUND

PLANE REQUIRED

TO IMPROVE

THERMAL

PERFORMANCE

Figure 11. Suggested Component Placement for SEPIC Topology

(Both DFN And MSOP Packages. Not to Scale). Pin 9 (Exposed

Pad) Must Be Soldered Directly to the Local Ground Plane for

Adequate Thermal Performance. Multiple Vias to Additional

Ground Planes Will Improve Thermal Performance

GND

1

C1

2

VIN

3

4

L1

SW

L2

C2

D1

C3

VOUT

8

9

7

6

5

SYNC

SHDN

8580 F12

VIAS TO GROUND

PLANE REQUIRED

TO IMPROVE

THERMAL

PERFORMANCE

Figure 12. Suggested Component Placement for Inverting Topology (Both DFN and MSOP Packages. Not to Scale).

Note Cut in Ground Copper at Diode’s Cathode. Pin 9 (Exposed Pad) Must be Soldered Directly to Local Ground Plane

for Adequate Thermal Performance. Multiple Vias to Additional Ground Planes Will Improve Thermal Performance

8580f

20

For more information www.linear.com/LT8580

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