VNI4140KTR-32(2012) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

VNI4140KTR-32
(Rev.:2012)

Quad high side smart power solid state relay

STMicroelectronics 

VNI4140K-32

6

Thermal management

Thermal management

The power dissipation in the IC is the main factor that sets the safe operating condition of

the device in the application. Therefore, it must be very carefully considered. Furthermore,

the available space on the PCB should be chosen considering the power dissipation.

Heatsinking can be achieved using copper on the PCB with proper area and thickness. Two

different protections have been implemented to guarantee safety of the device if it overheats

due to an overloaded condition or high environment temperature. The following flowchart

explains in detail this protection functionality.

Figure 5. Thermal behavior

Vin(i) = H

OUT(i) On

STAT(i) Off (H)

1)

NO

YES

Tj(i) > Ttsd

OUT(i) Off

STAT(i) On (L)

YES

NO

4)

Tc > Tcsd

YES

NO

Tc > Tcr

2)

NO

YES

Tj(i) > Tjr

3)

Doc ID022576 Rev 3

11/26

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