CY7C1041CV33-10BAXAT Ver la hoja de datos (PDF) - Cypress Semiconductor
Número de pieza
componentes Descripción
Fabricante
CY7C1041CV33-10BAXAT Datasheet PDF : 19 Pages
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CY7C1041CV33 Automotive
Capacitance
Parameter [3]
Description
CIN
COUT
Input Capacitance
Output Capacitance
Thermal Resistance
Parameter [3]
Description
ï‘JA
Thermal resistance
(junction to ambient)
ï‘JC
Thermal resistance
(junction to case)
Test Conditions
TA = 25 ï‚°C, f = 1 MHz, VCC = 3.3 V
Max
Unit
8
pF
8
pF
Test Conditions
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51
44-pin SOJ
25.99
18.8
44-pin TSOP II 48-ball FBGA Unit
42.96
38.15
ï‚°C/W
10.75
9.15
ï‚°C/W
AC Test Loads and Waveforms
Figure 3. AC Test Loads and Waveforms [4]
10-ns devices:
OUTPUT
Z = 50 ï—
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
50 ï—
1.5 V
(a)
30 pF*
12-, 15-, 20-ns devices: R 317ï—
3.3 V
OUTPUT
30 pF*
R2
351ï—
(b)
3.0 V
GND
ALL INPUT PULSES
90%
10%
90%
10%
Rise Time: 1 V/ns
(c)
Fall Time: 1 V/ns
High Z characteristics:
3.3 V
R 317ï—
OUTPUT
5 pF
R2
351ï—
(d)
Notes
3. Tested initially and after any design or process changes that may affect these parameters.
4. AC characteristics (except High Z) for 10 ns parts are tested using the load conditions shown in Figure 3 (a). All other speeds are tested using the Thevenin load
shown in Figure 3 (b). High Z characteristics are tested for all speeds using the test load shown in Figure 3 (d).
Document Number: 001-67307 Rev. *C
Page 6 of 18
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