HFBR-2115TZ Ver la hoja de datos (PDF) - Avago Technologies
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HFBR-2115TZ Datasheet PDF : 12 Pages
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Solder and Wash Process Compatibility
The transmitter and receiver are delivered with protec-
tive process caps covering the individual ST* ports. These
process caps protect the optical subassemblies during
wave solder and aqueous wash processing and act as dust
covers during shipping.
These data link modules are compatible with either
industry standard wave- or hand-solder processes.
Shipping Container
The data link modules are packaged in a shipping
container designed to protect it from mechanical and ESD
damage during shipment or storage.
Board Layout–Interface Circuit and Layout Guidelines
It is important to take care in the layout of your circuit
board to achieve optimum performance from these data
link modules. Figure 7 provides a good example of a
power supply filter circuit that works well with these parts.
Also, suggested signal terminations for the Data, Data-bar,
Signal Detect and Signal Detect-bar lines are shown. Use
of a multilayer, ground-plane printed circuit board will
provide good high-frequency circuit performance with
a low inductance ground return path. See additional
recommendations noted in the interface schematic
shown in Figure 7.
+5 Vdc
GND
DATA
DATA
Tx
*
A
L2
1
C2
0.1
R3 R2 R4 R1
82 82 130 130
9 NC
10 GND
11 VCC
12 VCC
13 GND
14 D
15 D
16 NC
NC 8
NO
PIN
7
GND 6
GND 5
GND 4
GND 3
VBB 2
NC 1
C5
0.1
TERMINATE D, D
AT Tx INPUTS
Rx
* 9 NC
NC 8
10
NO
PIN
GND 7
11 GND VCC 6
12 GND VCC 5
13 GND VCC 4
14 SD
D3
15 SD
16
NO
PIN
D2
NC 1
TOP VIEWS
L1
1
C1
C7
C3
C4
0.1
10
0.1
10
(OPTIONAL)
R7 R5 R8 R6
82 82 130 130
C6
0.1
R9
82
R11
82
SD
R10 R12
130 130
A
DATA
DATA
SD
TERMINATE D, D, SD, SD AT
INPUTS OF FOLLOW-ON DEVICES
Notes:
1. Resistance is in ohms. Capacitance is in microfarads. Inductance is in microhenries.
2. Terminate transmitter input data and data-bar at the transmitter input pins. Terminate the receiver output data, data-bar, and signal detect-bar at
the follow-on device input pins. For lower power dissipation in the signal detect termination circuitry with small compromise to the signal quality,
each signal detect output can be loaded with 510 ohms to ground instead of the two resistor, split-load pecl termination shown in this schematic.
3. Make differential signal paths short and of same length with equal termination impedance.
4. Signal traces should be 50 ohms microstrip or stripline transmission lines. Use multilayer, ground-plane printed circuit board for best highfrequency
performance.
5. Use high-frequency, monolithic ceramic bypass capacitors and low series DC resistance inductors. Recommend use of surface-mount coil
inductors and capacitors. In low noise power supply systems, ferrite bead inductors can be substituted for coil inductors. Locate power supply
filter components close to their respective power supply pins. C7 is an optional bypass capacitor for improved, low-frequency noise power supply
filter performance.
6. Device ground pins should be directly and individually connected to ground.
7. Caution: do not directly connect the fiber-optic module PECL outputs (data, data-bar, signal detect, signal detect-bar, VBB) to ground without
proper current limiting impedance.
8. (*) Optional metal ST optical port transmitter and receiver modules will have pins 8 and 9 electrically connected to the metal port only and not
connected to the internal signal ground.
Figure 7. Recommended interface circuitry and power supply filter circuits.
5
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