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ISPXPLD5512MX

3.3V, 2.5V and 1.8V In-System Programmable eXpanded Programmable Logic Device XPLD™ Family

Lattice Semiconductor 

Lattice Semiconductor

ispXPLD 5000MX Family Data Sheet

Absolute Maximum Ratings1, 2, 3

ispXPLD 5000MC

1.8V

ispXPLD 5000MB/V

2.5V/3.3V

Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 2.5V . . . . . . . . . . . . . . . . -0.5 to 5.5V

PLL Supply Voltage (VCCP) . . . . . . . . . . . . . . . . . . -0.5 to 2.5V . . . . . . . . . . . . . . . . -0.5 to 5.5V

Output Supply Voltage (VCCO) . . . . . . . . . . . . . . . . -0.5 to 4.5V . . . . . . . . . . . . . . . . -0.5 to 4.5V

IEEE 1149.1 TAP Supply Voltage (VCCJ) . . . . . . . . -0.5 to 4.5V . . . . . . . . . . . . . . . . -0.5 to 4.5V

Input Voltage Applied4, 5 . . . . . . . . . . . . . . . . . . . . . -0.5 to 5.5V . . . . . . . . . . . . . . . . -0.5 to 5.5V

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C . . . . . . . . . . . . . . . -65 to 150°C

Junction Temperature (TJ) with Power Applied . . . -55 to 150°C . . . . . . . . . . . . . . . -55 to 150°C

1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional

operation of the device at these or any other conditions above those indicated in the operational sections of this specification

is not implied (while programming, following the programming specifications).

2. Compliance with the Lattice Thermal Management document is required.

3. All voltages referenced to GND.

4. Overshoot and Undershoot of -2V to (VIHMAX +2) volts not to exceed 6V is permitted for a duration of <20ns.

5. A maximum of 64 I/Os per device with VIN > 3.6V is allowed.

Recommended Operating Conditions

Symbol

VCC

VCCP

TJ

Parameter

Supply Voltage for 1.8V Devices (ispXPLD 5000MC)

Supply Voltage for 2.5V Devices (ispXPLD 5000MB)

Supply Voltage for 3.3V Devices (ispXPLD 5000MV)

PLL Block Supply Voltage for PLL 1.8V Devices

PLL Block Supply Voltage for PLL 2.5V Devices

PLL Block Supply Voltage for PLL 3.3V Devices

Junction Temperature (Commercial Operation)

Junction Temperature (Industrial Operation)

Min.

1.65

2.3

3

1.65

2.3

3

0

-40

Max.

1.95

2.7

3.6

1.95

2.7

3.6

90

105

Units

V

V

V

V

V

V

C

C

E2CMOS Erase Reprogram Specifications

Parameter

Erase/Reprogram Cycle1

1. Valid over commercial temperature range.

Min.

1,000

Max.

—

Units

Cycles

Hot Socketing Characteristics1, 2, 3, 4

Symbol

Parameter

Condition

Min.

Typ.

Max. Units

IDK

Input or I/O Leakage Current

0 ≤ VIN ≤ 3.0V

—

+/-50 +/-800

μA

1. Insensitive to sequence of VCC and VCCO when VCCO ≤ 1.0V. For VCCO > 1.0V, VCC min must be present. However, assumes monotonic

rise/fall rates for VCC and VCCO, provided (VIN - VCCO) ≤ 3.6V.

2. 0 ≤ VCC ≤ VCC (MAX), 0 ≤ VCCO ≤ VCCO (MAX)

3. IDK is additive to IPU, IPD or IBH. Device defaults to pull-up until non-volatile cells are active.

4. LVTTL, LVCMOS only.

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