ENW89815CXKF Ver la hoja de datos (PDF) - Panasonic Corporation
Número de pieza
componentes Descripción
Fabricante
ENW89815CXKF Datasheet PDF : 34 Pages
| |||
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
PAGE
Seite
2 of 34
DATE
Datum
27.06.2011
TABLE OF CONTENTS
1. Key Features................................................................................................................... 4
2. Applications for the Module............................................................................................. 4
3. Description for the Module .............................................................................................. 5
4. Scope of this Document .................................................................................................. 6
5. History for this Document................................................................................................ 6
6. Terminal Layout .............................................................................................................. 7
6.1. General Pin Assignment ........................................................................................ 8
6.2. Application Specific Pin Description ...................................................................... 9
6.2.1. SPP configuration DCE Mode .................................................................. 9
7. Terminal Specifics......................................................................................................... 10
7.1. RF-Interface - ANT .............................................................................................. 10
7.2. Power Supply....................................................................................................... 10
7.3. Power-On-Reset .................................................................................................. 10
7.4. UART Interface – TXD, RXD, CTS, RTS ............................................................. 11
7.5. 3-wire Serial Interface.......................................................................................... 12
7.6. USB Interface,...................................................................................................... 12
7.6.1. USB_DP, USB_DN ................................................................................ 12
7.7. GPIO Interface..................................................................................................... 12
7.8. ADC ..................................................................................................................... 12
7.9. DAC ..................................................................................................................... 12
7.10. PCM Interface...................................................................................................... 12
8. Key Parts List ................................................................................................................ 13
9. Test Conditions ............................................................................................................. 14
10. Absolute Maximum Ratings (1)....................................................................................... 14
11. Electrical Requirements ................................................................................................ 14
12. I/O Operating Characteristics........................................................................................ 15
13. USB Interface................................................................................................................ 15
14. Typical Current Consumption........................................................................................ 16
14.1. SPP Configuration ............................................................................................... 16
14.1.1. Deep Sleep State ................................................................................... 16
14.1.2. Power Down State.................................................................................. 16
14.1.3. Idle State ................................................................................................ 16
14.2. Power Consumption ............................................................................................ 16
14.3. Power-up time...................................................................................................... 17
15. Electrical RF-Characteristics......................................................................................... 17
16. Mechanical Requirements............................................................................................. 18
17. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 19
17.1. For lead solder..................................................................................................... 19
17.2. For leadfree solder............................................................................................... 19
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
www.pedeu.pansonic.de
Share Link: 