LOP476 Ver la hoja de datos (PDF) - OSRAM GmbH

Número de pieza

componentes Descripción

Fabricante

LOP476

PointLED

OSRAM GmbH 

Version 1.1

Recommended Solder Pad 9) page 19

Empfohlenes Lötpaddesign 9) Seite 19

Reflow soldering

Reflow-Löten

Padgeometrie für verbesserte Wärmeableitung

Paddesign for improved heat dissipation

3.6 (0.142)

2.6 (0.102)

LO P476

(0.5 (0.020))

(ø2.1 (0.083) +0.1 (0.004))

Bauteil positioniert, Rückseite

Component location on pad, backside

Lötstoplack

Solder resist

Recommended Solder Pad 9) page 19

Empfohlenes Lötpaddesign 9) Seite 19

0.7 (0.028)

Hole in PCB

2.6 (0.102)

OHAY1307

Reflow soldering

Reflow-Löten

ø2.3 (0.091)

Note:

2013-06-12

Lötstoplack

Solder resist

Kein Lötstoplack; kein Kupfer

No solder resist; no copper pad

OHAY2629

The lower solder pad layout represents the

recommended solder pad for top mounting.

11

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