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PACVGA200(2010) Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Fabricante
PACVGA200
(Rev.:2010)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
PACVGA200 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
PACVGA200
Mechanical Details
QSOP Mechanical Specifications:
PACVGA200 devices are packaged in 24-pin QSOP packages. Dimensions are presented below.
For complete information on the QSOP-24 package, see the California Micro Devices QSOP Package
Information document.
PACKAGE DIMENSIONS
Package
Pins
QSOP (JEDEC name is SSOP)
24
Dimensions
A
A1
B
C
D
E
e
H
L
# per tube
# per tape
and reel
Millimeters
Inches
Min
Max
Min
Max
1.35
1.75
0.053 0.069
0.10
0.25
0.004 0.010
0.20
0.30
0.008 0.012
0.18
0.25
0.007 0.010
8.56
8.73
0.337 0.344
3.81
3.98
0.150 0.157
0.64 BSC
0.025 BSC
5.79
6.19
0.228 0.244
0.40
1.27
0.016 0.050
55 pcs*
2500 pcs
Controlling dimension: inches
* This is an approximate number which may vary.
Package Dimensions for QSOP-24
Rev. 2 | Page 9 of 10 | www.onsemi.com

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